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Low Temperature Epoxy Glue

product description

Product Features

  • One-component epoxy resin
  • Low temperature curing
  • Long working life at room temperature
  • High adhesion to various substrates
  • High reliability and thermal resistance

Product number

Exterior Product Description Viscosity(50rpm) CTE(ppm/℃) Tg(℃) Modulus @ 25 ℃ Curing condition
Black liquid Low temperature curing 11000cps 60 25 550 10min/80℃